Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.
<ul>
<li>Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics</li>
<li>Includes coverage of environmentally friendly 'green encapsulants'</li>
<li>Presents coverage of faults and defects, and how to analyze and avoid them</li>
</ul>

Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications)

Engineering & Transportation

Pecht, Michael G.

Zhang, Jiawei

Ardebili, Haleh

Engineering

William Andrew

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach

Lall, Pradeep

Hakim, Edward B.

CRC-Press

The first book on Prognostics and Health Management of Electronics
Recently, the field of prognostics for electronic products has received increased attention due to the potential to provide early warning of system failures, forecast maintenance as needed, and reduce life cycle costs. In response to the subject's growing interest among industry, government, and academic professionals, this book provides a road map to the current challenges and opportunities for research and development in Prognostics and Health Management (PHM).
The book begins with a review of PHM and the techniques being developed to enable a prognostics approach for electronic products and systems. building on this foundation, the book then presents the state of the art in sensor systems for in-situ health and usage monitoring. Next, it discusses the various models and algorithms that can be utilized in PHM. Finally, it concludes with a discussion of the opportunities in future research.
Readers can use the information in this book to:
<ul>
<li>Detect and isolate faults</li>
<li>Reduce the occurrence of No Fault Found (NFF)</li>
<li>Provide advanced warning of system failures</li>
<li>Enable condition-based (predictive) maintenance</li>
<li>Obtain knowledge of load history for future design, qualification, and root cause analysis</li>
<li>Increase system availability through an extension of maintenance cycles and/or timely repair actions</li>
<li>Subtract life cycle costs of equipment from reduction in inspection costs, down time, and inventory</li>
</ul>
Prognostics and Health Management of Electronics is an indispensable reference for electrical engineers in manufacturing, systems maintenance, and management, as well as design engineers in all areas of electronics.

Prognostics and Health Management of Electronics

Wiley-Interscience

China's Electronics Industry is a comprehensive and current report on the technologies, manufacturing capabilities, and infrastructure that have made China a major player in the electronics industry. Not only does it cover the past, present, and future of important electronic technologies, but also the pros and cons of conducting business in China. This is an important reference for any company planning a venture in China as well as those who have already taken their first steps. It will also be of great interest to researchers and policy makers who need to know more about the role of central government in promoting strategic industries and assisting national science and technology development. Much of the data contained in the report is from 2006.No country has burst onto the economic scene as dramatically as China has in the past decade. It is the world's largest producer of many electronic products and has a leading edge semiconductor industry. This timely and comprehensive report from America's leading authority is a critical for anyone who is interested in working with China in the electronics field including business managers, academics, government institutes, foreign investors, as well as those who are interested in the past, present and future growth of China's Electronics Industry.If you are thinking about doing business in china's electronics industry, you must have this book.

China's Electronics Industry: The Definitive Guide for Companies and Policy Makers with Interest in China

Computers & Technology

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.

Science & Math

Technology

The Singapore and Malaysia Electronics Industries documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made Singapore and Malaysia successful in the electronics industry. The book covers major segments of the countries'electronics industry, including semiconductors, packaging, displays, printed circuit boards, and systems. In addition, this book examines the roles that government, associations, research organizations, educational institutions, and major companies have played in establishing an infrastructure where the industry can flourish.

Singapore and Malaysia Electronics Industries (The Electronics Industry Research Series)

Business & Money

Beane, Donald

Shukla, Anand

International

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)

Supply chains for electronic products are primarily driven by consumer electronics. Every year new mobile phones, computers and gaming consoles are introduced, driving the continued applicability of Moore's law. The semiconductor manufacturing industry is highly dynamic and releases new, better and cheaper products day by day. But what happens to long-field life products like airplanes or ships, which need the same components for decades? How do electronic and also non-electronic systems that need to be manufactured and supported of decades manage to continue operation using parts that were available for a few years at most? This book attempts to answer these questions. 
This is the only book on the market that covers obsolescence forecasting methodologies, including forecasting tactics for hardware and software that enable cost-effective proactive product life-cycle management. This book describes how to implement a comprehensive obsolescence management system within diverse companies. Strategies to the Prediction, Mitigation and Management of Product Obsolescence is a must-have work for all professionals in product/project management, sustainment engineering and purchasing.

Strategies to the Prediction, Mitigation and Management of Product Obsolescence

SANDBORN, PETER

Bartels, Bjoern

Ermel, Ulrich

Marketing & Sales

wiley

This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use in the field. The qualification methods and standard reliability assessments are reviewed, and their inability to assess the risks of free air cooling is discussed. The method of identifying the risks associated with free air cooling on equipment performance and reliability is introduced. A novel method of assessment for free air cooling is also proposed that utilizes prognostics and health management (PHM).
This book also: 
Describes how the implementation of free air cooling can save energy for cooling within the telecommunications infrastructure.
Analyzes the potential risks and failures of mechanisms possible in the implementation of free air cooling, which benefits manufacturers and equipment designers.
Presents prognostics-based assessments to identify and mitigate the risks of telecommunications equipment under free air cooling conditions, which can provide the early warning of equipment failures at operation stage without disturbing the data centers' service.
Optimum Cooling for Data Centers is an ideal book for researchers and engineers interested in designing and manufacturing equipment for use in telecom infrastructures.

Optimum Cooling of Data Centers: Application of Risk Assessment and Mitigation Techniques

Dai, Jun

Ohadi, Michael M.

Das, Diganta

Computer Science

Springer

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes―bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components.
In summary, this book:
<ul>
<li>Introduces copper wire bonding technologies</li>
<li>Presents copper wire bonding processes</li>
<li>Discusses copper wire bonding metallurgies</li>
<li>Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes</li>
<li>Covers the reliability tests and concerns</li>
<li>Covers the current implementation of copper wire bonding in the electronics industry</li>
<li> Features 120 figures and tables</li>
</ul>
Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

Copper Wire Bonding

Chauhan, Preeti S

Choubey, Anupam

Zhong, ZhaoWei

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