Melt Electrospinning: A Green Method to Produce Superfine Fibers

Science & Math

Liu, Yong

Ramakrishna, Seeram

Mohideen, Mohamedazeem M.

Li, Kaili

Biological Sciences

Academic Pr

Optical Burst Switching (OBS) offers a promising switching technique to support huge bandwidth requirements in optical backbone networks that use Wavelength Division Multiplexing. This book details the quality of service (QoS) issue in OBS networks. It examines the basic mechanisms to improve overall QoS in OBS networks as well as discusses the relative QoS differentiation among multiple service classes in OBS networks. Coverage also details absolute QoS provisioning in OBS networks, end-to-end QoS provisioning in OBS networks, and some non-mainstream research issues and future research directions in OBS networks.

Quality of Service in Optical Burst Switched Networks (Optical Networks)

Computers & Technology

Chua, Kee Chaing

Gurusamy, Mohan

Phung, Minh Hoang

Certification

Springer

The optical and electronic properties of semiconductors is a subject which today presents a major area in solid state sciences. This book is the first attempt to gather together information which is otherwise scattered throughout the scientific literature into a single comprehensive work. As such, the book will serve as an excellent introductory text for newcomers to the field as well as an indispensible reference volume for research workers.

Electronic Structure and Optical Properties of Semiconductors (Springer Series in Solid-State Sciences, Volume 75)

Physics

New Polymeric Products: Fundamentals, Forming Methods and Applications

Engineering & Transportation

Hu, Ping

Ge, Jing

Wang, Ce

Engineering

Elsevier

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. 
<ul>
<li>Models and simulates numerous processes in manufacturing, reliability and testing for the first time</li> <li>Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing</li> <li>Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products</li> <li>Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects</li> <li>Appendix and color images available for download from the book's companion website</li> </ul>
Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

Liu, Shen

wiley

Metal Electrodes for Battery Technologies

Ma, Jianmin

Ren, Yurong

Duan, Xiaochuan

Chen, Libao

Feng, Kaijia

Qian, Han

Tao Capital Normal University Beijing, Dongfeng

Chemistry

IOP Publishing Ltd.

Optical Burst Switching (OBS) offers a promising switching technique to support huge bandwidth requirements in optical backbone networks that use Wavelength Division Multiplexing. This book details the quality of service (QoS) issue in OBS networks. It examines the basic mechanisms to improve overall QoS in OBS networks as well as discusses the relative QoS differentiation among multiple service classes in OBS networks. Coverage also details absolute QoS provisioning in OBS networks, end-to-end QoS provisioning in OBS networks, and some non-mainstream research issues and future research directions in OBS networks.

Chua, Kee Chaing Chaing

Networking & Cloud Computing

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Tujia Paintings and Woodcarvings in Guizhou and Their Development in the Qing Dynasty (A Selection of Guizhou Folk Arts from Li)

Arts & Photography

Royal Collins Publishing Company

This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field.

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