The use of silicon-on-insulator (SOI) technology in microelectronics is proliferating and is ready to be applied in a growing number of IC fabrication situations. Bonding of single crystal Si to dielectrics, normally silicon dioxide, is a key method of producing SOI structures and this work is designed to assist engineers directly in applying emerging SOI technology in practice. Wafer bonding principles, grind and polish back, Smartcut, Eltran and wafer characterization are all explained and illustrated for the benefit of the process development engineer. 
Also available:
Silicide Technology for Integrated Circuits - ISBN 9780863413520 Fabrication of GaAs Devices - ISBN 9780863413537
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Silicon Wafer Bonding Technology for Vlsi and Mems Applications (Emis Processing Series, 1)

Engineering & Transportation

Subramanian S. Iyer

Engineering

Inst of Engineering & Technology

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Books by Subramanian S. Iyer

See the best price to sell, buy, or rent books by Subramanian S. Iyer. BookScouter helps to compare book prices from 25+ online bookstores and 30+ buyback vendors with a single search.

Silicon Wafer Bonding Technology for Vlsi and Mems Applications (Emis Processing Series, 1)