A summary of progress in ball grid array (BGA) packaging technology, for professionals in BGA research and development, and for manufacturers researching BGA for their interconnect systems. Discusses economic, design, material, process, and quality issues, and describes techniques for processing substrates, routing PCB, assembling CBGA, PBGA, and TBGA packages, and inspection of BGA PCB assemblies. Includes treatment of BGA industry infrastructure, and an electronic packaging glossary. Contains b&amp;w photos and diagrams. Annotation copyright Book News, Inc. Portland, Or.

Ball Grid Array Technology

Engineering & Transportation

Lau, John H.

Engineering

McGraw-Hill Professional

A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation c. by Book News, Inc., Portland, Or.

Flip Chip Technologies

This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Pao, Yi-Hsin

The ultimate, up-to-the-minute electronic packaging resource The ever-increasing pin counts and clock speeds of modern electronics continue to "push the performance envelope" with regard to designing packaging and interconnection solutions that can meet increasingly challenging requirements. Here's the help you need! 
 For the first time, four well-known experts representing the four relevant fields--mechanical engineering, electrical engineering, thermal management, and materials--team up to provide a single-volume comprehensive reference that explains packaging and interconnection basics, details design tradeoff considerations, and presents specific system-level solutions. This unprecedented and unsurpassed multi-disciplinary coverage not only includes all the new technologies--BGA, Flip Chip, DCA, and CSP--it shows how they can be most effectively integrated. 
 With its clear explication of both theoretical and practical issues, Electronic Packaging will be of considerable and continuing value if you hope to design and/or refine more reliable, robust, and cost-effective packaging solutions for virtually any interconnect system.

Electronic Packaging: Design, Materials, Process, and Reliability

Wong, C.P.

PRINCE,J.L.

The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, Chip Scale Package hands engineers and designers the complete, professional set of working tools that they need to solve technical and design issues; find the most efficient, cost-effective CSP solutions for their deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and other major companies; and learn about CSP products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, youÕll see why itÕs the resource of choice for those who want to be at the top of the game.

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

Lee, Ricky S.W.

Lee, S.W. Ricky

One-stop, cutting-edge guide to flip chip technologies. Now you can turn to a single, all-encompassing reference for a practical understanding of the fast-developing field that's taking the electronics industry by storm. Low-Cost Flip Chip Technologies, by John H. Lau, brings you up to speed on the economic, design, materials, process,equipment, quality, manufacturing, and reliability issues related to low cost flip chip technologies. This eye-opening overview tells you what you need to know about applying flip chip technologies to direct chip attach(DCA), flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. You'll discover flip chip problem-solving methods, and learn how to choose a cost-effective design and reliable, high-yield manufacturing process for your interconnect systems as you explore...
*IC trends and packaging technology updates *Over 12 different wafer-bumping methods...more than 100 lead-free solder alloys *Sequential build up PCB with microvias and via-in-pad *How to select underfill materials *And much, much more!

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALSThis comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.
Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:
 * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste printing methods * Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates * Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs * Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate * Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages * Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging * Environmental issues for conventional PCBs and substrates * Some environmentally conscious flame-retardants for PCBs and organic substrates * Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety * Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives * Criteria, development approaches, and varieties of alloys and properties of lead-free solders * Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders * Manufacturing process and performance of lead-free surface finishes for both PCB and component applications * Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process * Fundamental understanding of electrically conductive adhesive (ECA) technology * Effects of lubricant removal and cure shrinkage on ECAs * Mechanisms underlying the contact resistance shifts of ECAs * Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs * Stabilization of contact resistance of ECAs using various additives

Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials

Business & Money

Lee, Ning-Cheng

Job Hunting & Careers

McGraw=Hill

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. A comprehensive guide to 3D MEMS packaging methods and solutions
Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging.
This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored:
<ul>
<li>Advanced IC and MEMS packaging trends</li>
<li>MEMS devices, commercial applications, and markets</li>
<li>More than 360 MEMS packaging patents and 10 3D MEMS packaging designs</li>
<li>TSV for 3D MEMS packaging</li>
<li>MEMS wafer thinning, dicing, and handling</li>
<li>Low-temperature C2C, C2W, and W2W bonding</li>
<li>Reliability of RoHS-compliant MEMS packaging</li>
<li>Micromachining and water bonding techniques</li>
<li>Actuation mechanisms and integrated micromachining</li>
<li>Bubble switch, optical switch, and VOA MEMS packaging</li>
<li>Bolometer and accelerameter MEMS packaging</li>
<li>Bio-MEMS and biosensor MEMS packaging</li>
<li>RF MEMS switches, tunable circuits, and packaging</li>
</ul>

Advanced MEMS Packaging

Computers & Technology

Aibin, Yu

Lee, Cheng Kuo

Premachandran, C. S.

Networking & Cloud Computing

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
 Proven 2D and 3D IC lead-free interconnect reliability techniquesReliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of:
<ul>
<li>2D and 3D IC lead-free interconnects</li>
<li>CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints</li>
<li>Lead-free (SACX) solder joints</li>
<li>Low-temperature lead-free (SnBiAg) solder joints</li>
<li>Solder joints with voids, high strain rate, and high ramp rate</li>
<li>VCSEL and LED lead-free interconnects</li>
<li>3D LED and 3D MEMS with TSVs</li>
<li>Chip-to-wafer (C2W) bonding and lead-free interconnects</li>
<li>Wafer-to-wafer (W2W) bonding and lead-free interconnects</li>
<li>3D IC chip stacking with low-temperature bonding</li>
<li>TSV interposers and lead-free interconnects</li>
<li>Electromigration of lead-free microbumps for 3D IC integration</li>
</ul>

Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
 A comprehensive guide to TSV and other enabling technologies for 3D integrationWritten by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.
This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.
Coverage includes:
<ul>
<li>Nanotechnology and 3D integration for the semiconductor industry</li>
<li>TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing</li>
<li>TSVs: mechanical, thermal, and electrical behaviors</li>
<li>Thin-wafer strength measurement</li>
<li>Wafer thinning and thin-wafer handling</li>
<li>Microbumping, assembly, and reliability</li>
<li>Microbump electromigration</li>
<li>Transient liquid-phase bonding: C2C, C2W, and W2W</li>
<li>2.5D IC integration with interposers</li>
<li>3D IC integration with interposers</li>
<li>Thermal management of 3D IC integration</li>
<li>3D IC packaging</li>
</ul>

Through-Silicon Vias for 3D Integration

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