Silicon carbide (SiC) is a wide bandgap semiconductor whose properties make it suitable for for devices and integrated circuits operating at high voltage, high frequency and high temperature. The second book in the EMIS Processing series explains why SiC is so useful in electronics, gives clear guidance on the various processing steps (growth, doping, etching, contact formation, dielectrics, etc.) and describes how these are integrated in device manufacture. The book should serve as an advanced tutorial and reference for those involved in applying the very latest technology emerging from university and commercial laboratories around the world. 
Also available:
Silicon Wafer Bonding Technology for VLSI and MEMS Applications - ISBN 9780852960394 SIMOX - ISBN 9780863413346
The Institution of Engineering and Technology is one of the world's leading professional societies for the engineering and technology community. The IET publishes more than 100 new titles every year; a rich mix of books, journals and magazines with a back catalogue of more than 350 books in 18 different subject areas including: 
 -Power &amp; Energy -Renewable Energy -Radar, Sonar &amp; Navigation -Electromagnetics -Electrical Measurement -History of Technology -Technology Management

Process Technology for SIC Devices (EMIS Processing Series, 2)

Engineering & Transportation

Carl-Mikael Zetterling

Engineering

Institution of Engineering and Technology

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Books by Carl-Mikael Zetterling

See the best price to sell, buy, or rent books by Carl-Mikael Zetterling. BookScouter helps to compare book prices from 25+ online bookstores and 30+ buyback vendors with a single search.

Process Technology for SIC Devices (EMIS Processing Series, 2)